当前位置:首页 > 能力及研发
联系我们
地址:重庆永川区兴龙大道2166号

订单热线:023-49826095/49821606 

质量反馈:023-49826118-8241 

技术支持:023-49827308/49827521 

盲埋孔
作者:admin发布时间:2015/12/28 8:50:00

Max. no of built up layer

1 on each side (1+n+1)

Layer of sub-core

>2L

Thk. Of sub-core (mil)

24-80

Min. Line spacing of inner layer/sub-core (mil)

3/4

Min. Line spacing of built up layer (mil)

3.5/3.5

Min. through hole size, (drill size in mil)

12

Built up material (1 ply)

 RCC, 106 and 1080 (FR-4 erferable)

Built up layer thickness

Not over 2.5 mil

Overall thickness of the board (mil)

32-128

Max. panel size

18"x24"

Surface Finsih

ENIG, Entek, No HSAL, No selective

Min. buried via size (mil)

12

航凌官网
订阅号
航凌APP

版权所有 Copyright(C) 2015-2016 重庆航凌电路板有限公司

地址:重庆永川区兴龙大道2166号,电话:023-49826118-8220

渝ICP备 0500248